Our Focuses｜Sustainable Supply Chain｜Sustainable Supply Chain Upgrading Forum
Sustainable Supply Chain
Supply chain management is becoming regional and shorter than ever before. Therefore, how to manage supply chain to keep sustainability has become one of the main challenges today. In order to establish a more resilient and sustainable supply chain, Winbond has proactively promoted corporate sustainable development by broadening the scope of these efforts. For pursuring a long-term and sustainable partnerships with our suppliers, we also hope to attract potential suppliers who share the same vision of sustainable business operations with us. By implementing sustainable supply chain management policies, and collaborating on regular ESG supplier workshops, environmental conservation investigations, and supplier sustainability training courses, we are truly appreciated to embed sustainability elements into Winbond’s sustainable supply chain management system gradually.
15 Material Suppliers Participated in ESG Workshops
65 Material Suppliers Sustainable supply chain environmental surveys
8 packaging and testing outsourcers completed product carbon footprint inventory and verification
Winbond Sustainable Supply Chain Upgrading Forum
On Apr. 12, 2023, Winbond hosted the first Sustainable Supply Chain Upgrading Forum and convened 72 suppliers of raw material, Outsourced Semiconductor Assembly and Testing (OSAT), and packaging to attend. For achieving Winbond's ESG vision, we performed the theme of product carbon footprint and gradually deepened suppliers' correct understanding of it through courses and seminar in the first forum.
Winbond held the first Sustainable Supply Chain Upgrading Forum and built ESG vision with suppliers together.
Winbond hosted the first Sustainable Supply Chain Upgrading Forum and invited 72 suppliers of raw material, back-end packaging and testing, and packaging to take part in. The first ESG vision of Winbond Electronics is "E_carbon footprint becomes a measure of innovation contribution. S_practicing the core idea of benevolence, righteousness, propriety, wisdom and trustworthiness along with love yourself, love others, love people and things. G_integrity management”. Furthermore, clearly declaring to reach the goal of reducing the carbon emissions of Winbond supply chain by 10% by 2030 based on the data in 2021. In order to implement Winbond's ESG vision, we started with the theme of product carbon footprint in the first forum. Also, we gradually deepened suppliers' correct understanding of product carbon footprint by courses and seminars. In this way, we will work with suppliers to achieve the goal of digitalizing carbon emissions of products in the semiconductor industry.
Winbond, as a leading manufacturer of memory products, has been deeply involved in the ESG field for a long time. In the sustainable supply chain management, in addition to following the declaration of "No one will be left behind" in the United Nations' "2030 Agenda for Sustainable Development", it has combined with the United Nations Sustainable Development Goals (SDGs), including the implementation of "responsible production and consumption", "response to climate change", and "multiple partnerships". The senior executives of the Materials Department have regularly invited key suppliers who have been working in the ESG field for many years to learn since the "Co-Sustainability" project was started in 2022. Moreover, we annually collect data of water usage, waste disposal, greenhouse gas, energy management, and product carbon footprint practices to find out how to overcome the core issues of supply chain resilience while facing climate changes and incorporate it into regular discussions of the forum.
In this forum, Ivan Cheng, chief technology officer of the British Standards Institute (BSI), shared the key points of the carbon footprint inspection and verification practice of semiconductor industry products. Continued by Chin-Yang Lin, the manager of the Sustainability Department of TOPCO Technology, provided valuable tips for overcoming challenges based on her experience in actually implementing carbon footprint checks. Finally, BSI, TOPCO Technology and Winbond held a meeting to discuss five major topics regarding the international requirements for product carbon footprint check and verification.
Last but not the least, in order to thank suppliers and partners and to increase our contribution to Taiwan's environment and society, Winbond prepared XINGJIAN Rice and small bag sewn by the women who live in the local community as gifts for the participants. Winbond said that the sustainable significance of the various activities in the forum is make the original intention of sustainability not only to the semiconductor industry but to spread the sustainable influence through cross-border and multi-field interaction. While increasing local procurement, it can also create more meaningful sustainable synergies.
Winbond said that in the future, through the regular forum, it hopes that current suppliers who are willing to join the ranks of sustainability will be given suitable resources and momentum. And through the operation of "multiple partnerships", we will invite suppliers with sustainable performance to share so that we can expect the implementation of the United Nations declaration of "No one will be left behind". The key cornerstone of Winbond's ESG vision is work together with every supplier to co-create sustainable value.