Jointly cultivating semiconductor talent in Taiwan through industry-academia collaboration

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Jointly cultivating semiconductor talent in Taiwan through industry-academia collaboration

Spotlight Story2023.06.30
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To enhance the quality of semiconductor talent in Taiwan, Winbond actively supports the collaboration between industry, government, and academia to foster talent. Through various means such as technology exchange, knowledge sharing, and teaching, Winbond actively participates in the cultivation of talent in society, aiming to enhance Taiwan's industrial competitiveness.

Establishing Semiconductor Program to cultivate the next generation of talent

With a sense of responsibility for the development of Taiwan's semiconductor industry and talent cultivation, Winbond invested nearly NT$10 million each year to assist in the establishment of the Academy of Innovative Semiconductor and Sustainable Manufacturing at National Cheng Kung University. In 2022, Winbond collaborated with the Academy to launch the "Semiconductor Program," which was planned by Winbond's senior executives. The program aims to help students lead the future semiconductor industry and develop a foundational understanding of artificial intelligence. Winbond also provides scholarships, internship/visit opportunities, guaranteed job interviews, and signing bonuses as part of its high-quality programs, encouraging the new generation of talent to join the semiconductor industry. As of 2022, over a hundred students have participated in Winbond's Semiconductor Program.

Semiconductor Program Planning

 
Target I
Essential semiconductor expertise and skills

Semiconductor professional knowledge

Required 24 credits
Elective 6 credits
(Semiconductor process/Linear algebra/Experimental design, etc.)
 
Target II
Possessing data science concepts
(Next-generation requirements)

Fundamentals of AI courses

Required 3 credits
(Data analysis, machine learning, computer vision, etc.)
 
Target III
Core competencies
(Practical and quick integration into the organization)

Key technologies and leadership practices courses

Required 3 credits
(Taught by industry experts from Winbond)
Component process integration program
Equipment program
Total 36 credits

Collaborative smart manufacturing project for joint research and innovation environment

From 2021 to 2022, Winbond cooperated with Professor Chia-Yen Lee of National Taiwan University on smart manufacturing project. The graduate students led by the professor and Winbond jointly conducted project development and research. The main contents included "Data Analytics Efficiency", "Quality Enhancement", "Yield Improvement", "Energy Saving Analysis" and other topics to help students connect with the industry in advance while at school.

Research and development sponsorship for industry upgrading

Winbond sponsored the "Chair Professor Research Grant" project at National Yang Ming Chiao Tung University to assist the university in enhancing its academic standards. The sponsorship aimed to attract and retain outstanding domestic and international scholars, supporting professors in continuously improving their teaching and research capabilities, with a dedication to advancing academic research and fostering talent development in the field of information and communication technology. By combining resources with academia, Winbond strives to improve the environmental quality of the semiconductor industry.