Our Focuses|Green Product|Product Life Cycle
Product Life Cycle
Winbond's main core products included Code Storage Flash Memory, TrustME® Secure Flash, and Customized Memory Solution
(CMS). They gradually introduced ISO 14067 for product carbon footprint and ISO 14046 for product water footprint. Using the 2023 production information, they conducted a Life Cycle Assessment (LCA) for the entire product series with the Simapro Environmental
Footprint 3.1 tool. This analysis evaluated the potential environmental impacts and calculated the environmental footprint during
the raw material and production stages, such as global warming and ozone layer depletion. Through hotspot analysis, they
identified improvement opportunities to enhance the environmental friendliness of raw materials and products.
According to ISO 14040 and ISO 14044 standards, they conducted a Life Cycle Assessment for products. The system boundary
referred to the Product-Category Rules (PCR) announced by the Taiwan Semiconductor Industry Association: "For use in preparing
'Semiconductor Foundry' product environmental declarations (EPD) version 2.1 for scope definition." As the company did not
belong to end products, they adopted Cradle-to-gate as the calculation boundary, including all chip substrates, chemicals, gases,
and consumables used in the memory raw material acquisition stage, as well as the energy resources and waste used in the
Winbond fab stage.