Our Focuses｜Green Product｜Product Life Cycle
Green Product
Winbond has integrated our core innovative technology competencies with sustainable energy conservation and carbon reduction goals. Through green product design, digitalizing information systems, and improving production efficiency, Winbond can develop and optimize our products in various different areas, strictly controlling each step of our product process. Winbond promises to deliver the highest quality products to customers, minimizing the carbon emissions required to deliver our products into the hands of customers and consumers. While benefiting from the convenience brought about by technology, Winbond is lowing the impact to environment and helping the overall value chain effectively reducing carbon emissions.
2nd-Gen 1.2V NOR Flash further improving energy efficiency beyond the 50% power savings achieved over 1.8V products
40
%
Enhanced the energy efficiency of CUBE memory solutions
1
pJ/bit
Shipments of Renewable Energy parts
9
%
Product Life Cycle
Winbond’s core products included Code Storage Flash memory, TrustME® Secure Flash, and Customized Memory Solutions (CMS). ISO 14067 product carbon footprint and ISO 14046 product water footprint were progressively introduced. Using 2023 production information, Winbond applied a product life cycle assessment tool (Simapro Environmental Footprint 3.1) to conduct life cycle assessment (LCA) for the full product portfolio. Potential environmental impacts were assessed and environmental footprints were calculated across dimensions including global warming and ozone depletion. Hotspot analysis identified improvement opportunities and enhanced the environmental performance of raw materials and products.
Life cycle assessment (LCA) was conducted in accordance with ISO 14040 and ISO 14044 standards. System boundary was defined in line with the Taiwan Semiconductor Industry Association’s Product Category Rules (PCR) for Environmental Product Declaration (EPD) for“ Semiconductor Foundry” (PCR v2.1). As Winbond did not produce end products, the calculation boundary adopted a cradle-to-gate approach. The boundary included transport of chip substrates, chemicals, gases, and consumables used during the raw material stage, as well as energy and resource inputs, waste, and other elements associated with wafer fabrication at Winbond.
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