Our Focuses｜Social Inclusion｜Talent Development
Social Inclusion
Winbond’s headquarters is located in the Central Taiwan Science Park in Taichung City, with additional facilities and offices in Kaohsiung City and Hsinchu County/City. As a result, the scope of Winbond’s community engagement encompasses these three regions. For communities in Kaohsiung and Hsinchu, where the headquarters is not located, the company prioritizes sustainability initiatives and improvement measures based on operational needs and resource allocation considerations.
To advance its ESG vision, Winbond aligned with the United Nations Sustainable Development Goals (SDGs) and continued to invest resources under three core strategies:“ Talent Development,”“ Social Welfare and Environmental Education,” and“ Nature-based Solutions.” By integrating internal and external resources—such as stakeholders including customers, suppliers, public-sector entities, universities, and NGOs—the Company promoted community development and environmental improvement and amplified the impact of social inclusion initiatives.
Total number of donors in 2025
1208
donors
Total amount of social welfare donations in 2025
29020000
NTD
Benefiting from scholarships in 2025
1028
students
Academic Sponsorship-Research and Development: Advancing Industry Upgrades
Winbond has long sponsored the International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) and the International Symposium on VLSI Design, Automation and Test (VLSI-DAT). These efforts accelerate the advancement of Taiwan’s information and communications technology (ICT) industry and strengthen technical exchanges between global science and industrial communities. By fostering a platform for researchers in semiconductor process and design to exchange cutting-edge knowledge, Winbond contributes to the continuous refinement of Taiwan’s semiconductor technology.
Years of Consecutive Academic Support:
Academic Sponsorship-Chair Professor Research Fund at National Yang Ming Chiao Tung University
Winbond supports the university in enhancing its academic standards by attracting and retaining distinguished scholars from Taiwan and abroad. The fund enables professors to continuously refine their teaching and research, driving progress in the ICT field. By integrating academic resources with industry needs, this initiative aims to cultivate top talent and improve the overall quality of the semiconductor industry.
Years of Consecutive Academic Support:
Campus talent development programs-Industry–Academia Co-creation to Build a Next-generation Technology Talent Pipeline
Winbond (Taiwan) promoted semiconductor science education. Through the Sasebo High School Taiwan visit
program in 2025, 46 students and teachers visited the Taichung production line to learn about memory technology
innovations and industry dynamics, strengthening Taiwan–Japan industry–academia exchange and communicating
Winbond’s core values to the next generation of global talent.
Campus talent development programs-Semiconductor Leadership Program
Winbond (Taiwan) invested close to NT$10 million each year to cultivate future talent. Since 2022, Winbond supported National Cheng Kung University (NCKU) in establishing the Academy of Intelligent Semiconductors and Sustainable Manufacturing and co-developed the Semiconductor Leadership Program, including a 3-credit course. Senior executives from Winbond (Taiwan) contributed to program and course design, integrating practice and expertise. Joint research projects and industry–academia exchange strengthened students’ R&D capabilities and horizons and laid a foundation for leadership in semiconductors and artificial intelligence, enhancing future employability.
Cumulative Enrollment in the “Semiconductor Key Technologies and Leadership Practice” Course:
729
