Our Focuses|Social Inclusion|Academic Education

Social Inclusion

Winbond’s headquarters is located in the Central Taiwan Science Park in Taichung City, with additional facilities and offices in Kaohsiung City and Hsinchu County/City. As a result, the scope of Winbond’s community engagement encompasses these three regions. For communities in Kaohsiung and Hsinchu, where the headquarters is not located, the company prioritizes sustainability initiatives and improvement measures based on operational needs and resource allocation considerations.
To fulfill its ESG vision, Winbond integrates the United Nations Sustainable Development Goals (SDGs) to tackle various societal challenges. It incorporates Winbond's core strengths into three main strategic initiatives: Talent Development, Nature-based Solutions, and the Promotion of Charity and Environmental Protection, aiming to leverage resources for social impact.
1.Talent Development: Winbond is committed to fostering individuals by imparting new knowledge and skills, thereby offering opportunities for their development. Notable initiatives in 2023 include the "Semiconductor Academy," "Academic Sponsorship," and organizing "Cultural Events.”
2.Natural-based Solutions: In line with achieving the 2050 net-zero target, Winbond collaborates with various sectors to promote industry-academia-government cooperation programs. Key projects in 2023 include "Afforestation" and "Conservation and Breeding," aimed at carbon removal from the atmosphere and enhancing biodiversity simultaneously.
3.Promotion of Charity and Environmental Protection: Winbond dedicates resources to assist vulnerable groups and improve livelihoods. Key initiatives in 2023 include "Supporting the Disadvantaged," "Emergency Aid," and "Environmental Protection."

SDGs 17 Partnerships for the Goals
SDGs 13 Climate Action
SDGs 9 Industry, Innovation and Infrastructure
SDGs 8 Decent Work and Economic Growth
SDGs4
SDGs3 Good Health and Well-Being

Total Social Welfare Investment Amount in 2024

23696109

NTD

Education Financial Aid Raised for Impoverished Students in 2024

4248000

NTD

Supporting elementary school students for a whole year

1062

beneficiaries

Academic Education

Academic Education

Sponsorship for Research and Development: Advancing Industry Upgrades

Winbond has long sponsored the International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) and the International Symposium on VLSI Design, Automation and Test (VLSI-DAT). These efforts accelerate the advancement of Taiwan’s information and communications technology (ICT) industry and strengthen technical exchanges between global science and industrial communities. By fostering a platform for researchers in semiconductor process and design to exchange cutting-edge knowledge, Winbond contributes to the continuous refinement of Taiwan’s semiconductor technology.

 

Years of Consecutive Academic Support:
22 years
Chair Professor Research Fund at National Yang Ming Chiao Tung University

Winbond supports the university in enhancing its academic standards by attracting and retaining distinguished scholars from Taiwan and abroad. The fund enables professors to continuously refine their teaching and research, driving progress in the ICT field. By integrating academic resources with industry needs, this initiative aims to cultivate top talent and improve the overall quality of the semiconductor industry.

 

Years of Consecutive Academic Support:
6 years