Our Focuses｜Green Product｜Research, Development, and Innovation
Green Product
Winbond has integrated our core innovative technology competencies with sustainable energy conservation and carbon reduction goals. Through green product design, digitalizing information systems, and improving production efficiency, Winbond can develop and optimize our products in various different areas, strictly controlling each step of our product process. Winbond promises to deliver the highest quality products to customers, minimizing the carbon emissions required to deliver our products into the hands of customers and consumers. While benefiting from the convenience brought about by technology, Winbond is lowing the impact to environment and helping the overall value chain effectively reducing carbon emissions.
Reduced product carbon emission by introducing Renewable energy
60
%
LPDDR4/4X saves standby power consumption compared to DDR4
90
%
Obtained the Taiwan Intellectual Property Management System Certification
Class A
for two consecutive years
Research, Development, and Innovation
Innovation in Technology and Services
Winbond provides global customers with comprehensive specialty Memory solutions. Core products include Code Storage Flash Memory, TrustME® Secure Flash Memory, Specialty DRAM, and Mobile DRAM, making Winbond the only Taiwanese manufacturer with proprietary technologies in both Flash and DRAM. Winbond leverages the synergies generated by its product portfolio and adopts a green product design philosophy to meet diverse customer needs. This enables customers to combine their expertise with Winbond's innovative green products for applications in hand-held devices, consumer electronics, computer peripherals, artificial intelligence, automotive, and industrial electronics markets. To achieve environmental friendliness and sustainable growth while providing customers with high-quality and innovative products and services, Winbond continuously invests in research and development, technology, and talent. Winbond is committed to developing innovative products and technologies and remains focused on the following issues:
- Development of green products in Flash memory, Secure Flash memory, Specialty DRAM, and Mobile DRAM
- Development and production processes of green products, along with achievements in carbon reduction and energy saving
- Key technology development focusing on high performance, small size, low energy consumption, high quality, and security
- Refinement in design and process miniaturization
- Innovation and intellectual property management
| Key Technology | HIghlight Products | Application |
|---|---|---|
| Low-Power NOR Flash Memory |
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| High-performance NAND Flash Memory |
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| Secure Flash Memory |
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| Low-Power Mobile Memory |
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Semiconductor Industrial Chain
Winbond possesses an advanced and complete semiconductor industrial chain and professional specialization. This includes IP (Intellectual Property Rights) design and IC (Integrated Circuit) design, wafer fabrication, chip probing, and backend packaging and testing. Additionally, Winbond has been deeply involved in the KGD (Known Good Die) field for many years, working together with chip factories to provide SiP (System in Package) multichip packaging solutions and creating more value in collaboration with the semiconductor industrial chain.
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Code Storage Flash Memory
Winbond is a leading manufacturer of flash memory, continuously striving to reduce the carbon footprint and power consumption of its products. For example, with the evolution of the process to the new generation of 45nm products,the area of a single die has been significantly reduced. In addition, the new generation of products also supports smaller packaging types, greatly reducing the carbon footprint of Flash products during wafer anufacturing and packaging stages. Taking the 128Mb NOR Flash in the new generation 45nm PW series as an example, its single die area is reduced to 50% of the 58nm product of the same capacity, and it can support smaller USON packaging. Ultimately, the carbon footprint is reduced by 18% compared to the 58nm FW series. Based on the sales volume of the new generation Serial NOR Flash in 2024, it saved 5.6 tCO2e compared to the 58nm products.
1.2 NOR Flash | |
|---|---|
| Total Powe Consumption | 50% less power consumed compared to the 1.8V NOR Flash in mainstream use today
(Based on the data from the Forestry and Nature Conservation Agency of the Ministry of Agriculture and the Department of Land Administration of the Taipei City Government: Daan Forest Park annually absorbs approximately 386 tCO2e). |
| Performance | Maintains similar transition level as 1.8V/3V Flash |
| Application | Wireless headphones, smart watches, smart wristbands, smart glasses, and other wearable devices with high power-saving requirements |
Customized Memory Solution (CMS)
Winbond launched the 100 BGA LPDDR4/4x solution with high performance and low power consumption advantages. The solution adopted a smaller 100BGA package, reducing its size by 50% compared to the standard 200BGA package. The reduction in package size also meant that carbon emissions related to packaging could be reduced by 50%. The 100BGA package was fully downward compatible with existing 200BGA single die package (SDP). By adjusting the PCBA layout, customers could directly adopt this advanced memory packaging solution without large-scale rework, thereby reducing resource consumption.
Additionally, to meet the low power consumption needs of emerging consumer trends such as wearable and smart devices, Winbond launched the 1.2V HYPERRAM, which saved 33% power consumption compared to the original 1.8V HYPERRAM. Under the usage scenario of 8 hours of operation per day, with 80% reading, 10% standby, and 10% sleep mode, after 3 years of use, based on the total sales of 1.2V HyperRAM in 2024, it saved 268,265 kWh of power consumption (equivalent to 967,051 million joules) compared to 1.8V HyperRAM, approximately reducing 127 tCO2e.Combined with high transfer rates, it provided customers with competitive and long-lasting battery life design solutions for smart wearables.
In 2024, Winbond focused on the development of DDR4 niche memory and launched the first 20nm DDR4 product. Compared to DDR3, DDR4 offered higher bandwidth and lower power consumption, providing better performance and efficiency. It was widely used in high-end industrial computers and industrial control devices, high-specification television and audio-visual equipment, and enterprise-grade network equipment. Additionally, through the evolution of process technology nodes, the product's carbon emissions were reduced. The next-generation 16nm DDR4 product was expected to be launched in 2025..
LPDDR4/4X
Winbond's LPDDR4/4X DRAM, the fourth generation of low-power memory,achieved a data transfer rate of 4,267 Mbps. In terms of energy consumption, with the VDDQ voltage reduced to 1.1/0.6V, it significantly lowered power usage, effectively extending battery life and achieving high performance and energy-saving goals.
100BGA Form Factor
Winbond's latest packaging, 100BGA LPDDR4/4X, has a size of only 7.5x10 mm2, which is 50% smaller compared to the 200BGA 14.5x10 mm2, and reduces packaging-related carbon emissions by 50%. The 100BGA packaging is fully downward compatible with the existing 200BGA single-chip packaging, allowing for adjustments to the PCBA layout without requiring extensive rework, thereby reducing resource consumption.
DDR4
In 2024, Winbond launched the 20nm DDR4 product, which offers higher bandwidth and lower power consumption compared to DDR3,providing better performance and efficiency. With the advancement of process technology nodes, its process carbon emissions can continue to decrease, and the 16nm DDR4 product is expected to be launched in 2025.
Secure Flash Memory
"Security" is not only a technical issue but also a societal and ethical one. Security has significant impacts on the welfare and rights of society, economy, environment, individuals, and organizations, especially in today's digital transformation era and the economic losses and security threats caused by hackers through security vulnerabilities. Security ensures the confidentiality, integrity, and availability of data, information, and assets, preventing unauthorized access, modification, or destruction. Security also enables trust, privacy, and compliance in various sectors such as finance, healthcare, education, and government. However, security is not a one-time task or a static state. It requires continuous monitoring, updating, and improvement to address evolving challenges and risks. Security involves multiple layers, from hardware to software, from networks to the cloud, from users to devices. Therefore, security requires a comprehensive approach covering all aspects of systems and their environments.
Winbond recognizes the severity of these challenges and has pioneered the development and launch of the TrustME® Secure Flash Memory product line. Secure memory is used to store sensitive data and code such as encryption keys, passwords, certificates, and firmware. Secure memory ensures that data and code are protected from unauthorized access, modification, or leakage both physically and logically. Secure memory also provides functions such as encryption, authentication, tamper detection, and self-destruction to enhance security levels and prevent attacks. These cutting-edge solutions are designed to protect Winbond customers' assets and create secure platforms, thus safeguarding end-users in various fields. Winbond’s secure Flash memory is applied in consumer IoT, industrial IoT, servers, networks, and automotive sectors. Winbond is committed to protecting customers from emerging cybersecurity threats. In anticipation of the upcoming post-quantum computing era, Winbond recently launched secure Flash memory enhanced with post-quantum encryption technology (PQC), ensuring that customers continue to enjoy robust protection in the evolving cybersecurity environment.
TrustME® Secure Serial Flash Memory | TrustME® Secure Serial Flash Memory |
|---|---|
| The W75F memory series was developed in response to the high security identify verification needs of mobile payment services and other applications, and due to confidential data storage requiring encrypted system hardware modules to possess EAL 5+ security certification. Products in the W75F series are the first secure Flash memory solution in the world to obtain Common Criteria (CC) EAL 5+ certification. They also support secure eXecute-in-Place (XiP), and are able to protect the confidentiality and integrity of codes and data stored in IoT devices. | The W77Q and W77T, compatible with traditional SPI specifications, offer essential security features for IoT endpoints, automotive, networks, and other types of connected devices. These features include hardware root of trust, secure boot, platform resilient, supply chain security confirmation, and robust data protection. Even if the host processor is compromised, the W77Q and W77T facilitate secure over-the-air software updates. |
Green Products
Winbond foresees the market trends of new generation products and continuously invests resources in pursuing green semiconductor design, energy-saving and carbon-reducing production technologies, green energy production, and sustainable innovation of products, aiming to nhance the competitive advantage of green products while providing customers with high-quality products and service support.
Winbond Green Product Manufacturing: Utilizing Renewable Energy for Product Manufacturing Demonstrates Commitment to Sustainable Development
Winbond actively promoted product innovation by reducing hazardous substances and carbon emissions in the manufacturing process, shortening production cycles, and lowering manufacturing costs. This approach helped develop smaller, more energy-efficient, and environmentally friendly products with low carbon emissions, while reducing the materials, electricity, carbon emissions, and power consumption of end devices during use, further reducing the carbon emissions of production electricity.
To further reduce the environmental impact of production and manufacturing, Winbond began using renewable energy for product manufacturing in 2024 and extended it to downstream packaging and testing plants. Green products manufactured with renewable energy represented the production and manufacturing at Winbond fabs, outsourced packaging plants, testing, and other processes, all powered by renewable energy, indicated by the 13th digit "G" in the product part number. Additionally, to effectively monitor carbon emission activities and achieve efficient real-time management, Winbond developed an advanced carbon accounting system. This system aggregated Scope 1 direct emissions from Winbond fabs, Scope 2 indirect emissions from electricity used at Winbond fabs, and Scope 3 other "indirect" greenhouse gas (GHG) emissions, integrating carbon emission information from manufacturing production and outsourced packaging and testing.
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Winbond's products manufactured with renewable energy began mass shipments to key ESG-focused customers in December 2024, marking a significant milestone in aligning with ESG market trends and meeting the growing demand for green energy-saving products. These products manufactured with renewable energy had approximately 60% lower carbon emissions compared to those produced with conventional energy. As a leading supplier of green semiconductor memory, this move further demonstrated our commitment to sustainable development, aiming to achieve net-zero emissions by 2050.
We believe that the future of the planet is closely related to the sustainable development of enterprises. Therefore, ensuring innovation and environmental responsibility is crucial for driving corporate development. With the launch of products manufactured with renewable energy, Winbond has established an important milestone in its sustainability journey.
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Green Innovation Research and Development
Predicting market trends for the new generation of products, Winbond has continuously invested resources into semiconductor design, manufacturing technologies, and sustainable innovations for products, creating competitive advantages and increasing market share for our green products. At the same time, Winbond has provided high quality products and services for our customers, whose needs Winbond has placed first.
Winbond green product development: Design considerations that take into account the product life cycle and reducing carbon emissions.
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Hazardous Substance Management of Winbond
Winbond strictly adheres to international guidelines and standards, such as the Hazardous Substance Process Management System Standard" (QC 080000), the "EU Restriction of Hazardous Substances Directive" (RoHS), the "Registration, Evaluation, Authorization and Restriction of Chemicals" (REACH), California Proposition 65, the U.S. Toxic Substances Control Act (TSCA), the Canadian Convention, and others. This ensures that the hazardous substance content in Winbond’s manufactured products—including wafers, chips, and packaged ICs—complies with international environmental regulations and customers’ green product requirements, thereby preventing environmental pollution and harm to human health. All of Winbond’s products are 100% rigorously evaluated, and annual ICP test reports issued by independent third parties confirm compliance with the aforementioned international regulations, with no potential impact on human health or environmental pollution. In addition, Winbond has established internal "Hazardous Substance Control Specifications" and formed a cross-departmental hazardous substance management team to control relevant processes such as product design, procurement, production, and sales. Suppliers and subcontractors are also required to incorporate green product requirements into their management systems, ultimately providing Hazardous Substance Free (HSF) products to meet customer demands. Winbond conducts R&D, procurement, production, operations, and services according to the following principles to ensure the reduction of the company’s operational impact and risks to the natural environment and human health. Winbond prioritizes materials that pose minimal environmental impact during the product’s end-of-life phase. While a product reaches the end of its service life, it can be processed with lower environmental burden, reducing the release of harmful substances and pollution risks.
HSF Policy
Winbond's HSF policy aimed to design, procure, manufacture, and sell products free of hazardous substances to comply with international regulations, meet customer requirements, and protect the environment, fulfilling its social responsibility.
Hazardous Substance Process Management
Winbond established a Hazardous Substance Process Management (HSPM) system, with management representatives holding annual review meetings to discuss policies, objectives, regulations, audit results, and management performance, continuously improving the effectiveness of the hazardous substance management system.
2024 Progress of Winbond
- No non-compliance issues related to hazardous substances monitoring have occurred
- 100% of Winbond personnel have completed hazardous substance training
- No non-compliance detected by customers' hazardous substance audits
Hazardous Substance Management of Nuvoton
Nuvoton implements a rigorous five-step process to manage hazardous substances in all its products, including:
- Declare a Hazardous Substance-Free Policy
- Establish a Hazardous Substance Control List
- New Material Evaluation System
- Green Procurement and Supplier Management
- Hazardous Substance Testing
2024 Progress of Nuvoton
- Non-compliance incidents in hazardous substance management operations: 0 cases
- 100 completion of basic training on hazardous substances
- Customer complaints related to hazardous substances: 0 cases
- Newly developed products and materials met Nuvoton's hazardous substance management requirements
- Completed annual hazardous substance content testing for wafer & IC to comply with RoHS and halogen-free requirements.
Intellectual Property Management
2024 Patent results of Winbond
Patent applications
- Cumulative number of worldwide patent applications exceed 6,900.
- Apply 430 patent applications in 2023.
- Ranking 13th in the top 100 domestic corporate invention patent applications in 2024
Patents granted
- Cumulative number of worldwide granted patents exceed 5,300.
- 380 Global Patents granted in 2023.
- Ranking 17th in the top 100 domestic corporate invention patent announcements and certifications in 2024
Note: Data sourced from the Ministry of Economic Affairs, Intellectual Property Office
2024 Patent results of Nuvoton
Patent applications
- Cumulative number of worldwide patent applications exceed 2,963.
- Apply 343 patent applications in 2023.
- Ranking 17th in the top 100 domestic corporate invention patent applications in 2024
Patents granted
- Cumulative number of worldwide granted patents exceed 1,984.
- 230 Global Patents granted in 2023.
- Ranking 14th in the top 100 domestic corporate invention patent announcements and certifications in 2024
Note: Data sourced from the Ministry of Economic Affairs, Intellectual Property Office
2024 Patent results of Nuvoton (Japan)
Patent applications
- Cumulative number of worldwide patent applications exceed 4,500.
- Apply 203 patent applications in 2023.
Patents granted
- Cumulative number of worldwide granted patents exceed 3,200.
- 106 Global Patents granted in 2023.
Note: Data sourced from the Ministry of Economic Affairs, Intellectual Property Office
Intellectual property rights were important assets for maintaining the sustainable operation of the enterprise. To protect the company's investment in R&D resources and output, Winbond formulated intellectual property policies that align with the company's operational objectives. Through the operation of the intellectual property management system, Winbond fostered an innovative culture and enhanced employees' awareness of intellectual property protection, encouraging employees to continuously propose innovations and produce high-quality intellectual property while performing their duties, thereby strengthening Winbond's ustainable competitive advantage.
Promotion of Trade Secret Registration System
Since 2022, Winbond has included trade secrets as part of its intellectual property management strategy, and has integrated technical content from its existing systems into the trade secret registration system, transforming it into a library of technical and innovative knowledge, where the company's competitive trade secrets are securely stored. In 2024, the total number of registered cases exceeded 11,300,with a cumulative registration of over 28,120 cases.
Winbond passed the TIPS re-certification in 2024
In 2023, Winbond officially implemented the "Taiwan Intellectual Property Management System (TIPS)" and passed the A-level certification. Through the introduction of TIPS, Winbond formulated intellectual property policies and goals that align with the company's operational objectives, fostering an innovative culture and enhancing employees'awareness of intellectual property protection. Employees were encouraged to continuously propose innovations and produce high-quality intellectual property, strengthening sustainable competitive advantages. In 2024, Winbond continued to implement TIPS and passed the A-level re-certification.
Intellectual Property Management Plan and Implementation
2024 Intellectual Property Management Plan and Implementation
Winbond passed the verification of the Taiwan Intellectual Property Management Standard (TIPS) on November 30, 2023. The certificate is valid until December 31, 2024.