Winbond Leads the "Carbon Data Electronic Exchange Standard," with 100% Participation from Packaging and Testing Partners

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Winbond Leads the "Carbon Data Electronic Exchange Standard," with 100% Participation from Packaging and Testing Partners

Spotlight Story2024.10.15
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Organizer: ESG Committee-Team of Sustainable Supply Chain

 

 

 
After fully implementing product carbon footprint audits in 2022 and undertaking the " Large leads small" low-carbon collaboration project in 2023, Winbond and all its packaging and testing partners are set to launch a new chapter in carbon management in 2024 through the electronic exchange of carbon data.

 

As global efforts to reduce carbon emissions intensify, end customers in the semiconductor industry are increasingly demanding the disclosure and reduction of carbon emissions from supply chain members as part of their procurement criteria. This means that companies that can comprehensively manage carbon emissions data across their supply chain will be better positioned to implement carbon reduction plans efficiently and earn the trust of major international clients. However, many suppliers in the electronics industry currently use self-developed digital platforms or manual Excel spreadsheets for carbon management, which can lead to data entry errors and inconsistencies in reporting. To meet the varying disclosure requirements of different clients, suppliers often face rework and inconsistent data formats, further reducing their willingness to disclose carbon information. As a leading memory manufacturer, Winbond not only sees itself as a responsible supply chain citizen but also aims to set an example for the industry, encouraging more members to join the sustainability journey. Thus, finding an efficient way to integrate carbon data across the supply chain has become a pressing priority. 

 

 

 

 

To address these challenges, in 2024, Winbond became the first semiconductor company to join the Pathfinder Framework, part of the Partnership for Carbon Transparency (PACT) initiative led by the Digital Transformation Institute of the Institute for Information Industry. Winbond selected its partners based on three key criteria: 1) practical experience in carbon footprint assessments, 2) a commitment to fostering a culture of carbon reduction, and 3) a long-term vision for the digitization of carbon data management. Packaging and testing partners, who have worked with Winbond for decades, have already been involved in carbon footprint and renewable energy procurement plans since 2022, and are key partners in the goal of achieving a 60% reduction in carbon emissions by 2030. Through Winbond's strong invitation, 100% of its packaging and testing suppliers in Taiwan have responded to the industry's pilot project, allowing Winbond's sustainable supply chain to form this representative demonstration team. Looking ahead, Winbond will implement the "Carbon Data Electronic Exchange Standard" throughout its low-carbon supply chain, leveraging the strength of its suppliers to fully digitize carbon data management and promote this approach across the broader electronics industry ecosystem.

 

 

 

 

 

 

 

 

 
Looking ahead, Winbond will establish a comprehensive carbon emission data exchange ecosystem to reduce carbon data management costs and enhance management efficiency. By collaborating with supply chain members to build carbon reduction pathways, we aim to collectively achieve the goal of a green, low-carbon supply chain.